[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Influence of interfacial delamination on temperature distribution of QFN packages
Zhaowei, Ban, Fei, Qin, Tong, An, Guofeng, Xia, Chengyan, LiuAnnée:
2011
Langue:
english
DOI:
10.1109/ICEPT.2011.6066889
Fichier:
PDF, 2.13 MB
english, 2011