Analysis of the UIS behavior of power devices by means of SPICE-based electrothermal simulations
d’Alessandro, Vincenzo, Magnani, Alessandro, Riccio, Michele, Iwahashi, Yohei, Breglio, Giovanni, Rinaldi, Niccolò, Irace, AndreaVolume:
53
Langue:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2013.07.083
Date:
September, 2013
Fichier:
PDF, 1.34 MB
english, 2013