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[ASME ASME 2009 Heat Transfer Summer Conference collocated with the InterPACK09 and 3rd Energy Sustainability Conferences - San Francisco, California, USA (July 19–23, 2009)] Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Heat Transfer Equipment; Heat Transfer in Electronic Equipment - Theoretical Study on Transient Hot-Strip Method by Numerical Analysis
Wei, Gaosheng, Du, Xiaoze, Zhang, Xinxin, Yu, FanAnnée:
2009
Langue:
english
DOI:
10.1115/HT2009-88114
Fichier:
PDF, 243 KB
english, 2009