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Electrical Modeling and Design for 3D System Integration (3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC) || Systematic Microwave Network Analysis for 3D Integrated Systems
Li, Er-PingVolume:
10.1002/97
Année:
2012
Langue:
english
DOI:
10.1002/9781118166727.ch5
Fichier:
PDF, 1.23 MB
english, 2012