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Fluid-to-Fluid Spot-to-Spreader (F2/S2) Hybrid Heat Sink for Integrated Chip-Level and Hot Spot-Level Thermal Management
Green, Craig, Fedorov, Andrei G., Joshi, Yogendra K.Volume:
131
Année:
2009
Langue:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.3104029
Fichier:
PDF, 1.23 MB
english, 2009