SPIE Proceedings [SPIE MOEMS-MEMS - San Francisco, California (Saturday 23 January 2010)] Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices IX - Wafer-level vacuum/hermetic packaging technologies for MEMS
Lee, Sang-Hyun, Mitchell, Jay, Welch, Warren, Lee, Sangwoo, Najafi, Khalil, Kullberg, Richard C., Ramesham, RajeshuniVolume:
7592
Année:
2010
Langue:
english
DOI:
10.1117/12.843831
Fichier:
PDF, 3.87 MB
english, 2010