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Development and Experimental Validation of a 3-D Solder Self-Alignment Model for Alignment Accuracy Prediction of Flip-Chip Assembly
Ming Kong, Sungeun Jeon, Hinmeng Au, Chiwon Hwang, Yung-Cheng LeeVolume:
1
Année:
2011
Langue:
english
DOI:
10.1109/tcpmt.2011.2162837
Fichier:
PDF, 1.75 MB
english, 2011