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Study on melt properties, microstructure, tensile properties of low Ag content Sn–Ag–Zn Lead-free solders
Tingbi Luo, Zhuo Chen, Anmin Hu, Ming LiVolume:
556
Année:
2012
Langue:
english
DOI:
10.1016/j.msea.2012.07.086
Fichier:
PDF, 1.56 MB
english, 2012