Application of Piezoresistive Stress Sensor in Wafer Bumping and Drop Impact Test of Embedded Ultrathin Device
Xiaowu Zhang, Rajoo, R., Selvanayagam, C.S., Kumar, A., Rao, V.S., Khan, N., Kripesh, V., Lau, J.H., Dim-Lee Kwong, Sundaram, V., Tummala, R.R.Volume:
2
Année:
2012
Langue:
english
DOI:
10.1109/tcpmt.2012.2192731
Fichier:
PDF, 1.16 MB
english, 2012
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