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Numerical simulation on thixoforging of electronic packaging shell with SiCp/A356 composites
Kai-kun WANG, Fu-yu WANG, Xue-jun CHEN, Lu WANG, Chun-mei MAVolume:
20
Année:
2010
Langue:
english
DOI:
10.1016/s1003-6326(09)60362-9
Fichier:
PDF, 618 KB
english, 2010