Effect of thermal-shearing cycling on Ag3Sn microstructural coarsening in SnAgCu solder
Lihua Qi, Jihua Huang, Xingke Zhao, Hua ZhangVolume:
469
Année:
2009
Langue:
english
DOI:
10.1016/j.jallcom.2008.01.108
Fichier:
PDF, 1.10 MB
english, 2009