High-Density Large-Area-Array Interconnects Formed by Low-Temperature Cu/Sn–Cu Bonding for Three-Dimensional Integrated Circuits
Lueck, M.R., Reed, J.D., Gregory, C.W., Huffman, A., Lannon, J.M., Temple, D.S.Volume:
59
Année:
2012
Langue:
english
Pages:
7
DOI:
10.1109/ted.2012.2193404
Fichier:
PDF, 710 KB
english, 2012