Mean-time-to-failure evaluations of encapsulation materials for LED package in accelerated thermal tests
Jau-Sheng Wang, Chun-Chin Tsai, Jyun-Sian Liou, Wei-Chih Cheng, Shun-Yuan Huang, Gi-Hung Chang, Wood-Hi ChengVolume:
52
Année:
2012
Langue:
english
Pages:
5
DOI:
10.1016/j.microrel.2011.07.057
Fichier:
PDF, 430 KB
english, 2012