Wettability of molten Sn–Bi–Cu solder on Cu substrate
Likun Zang, Zhangfu Yuan, Hongxin Zhao, Xiaorui ZhangVolume:
63
Année:
2009
Langue:
english
Pages:
3
DOI:
10.1016/j.matlet.2009.06.052
Fichier:
PDF, 377 KB
english, 2009