Microstructure, corrosion behaviour and microhardness of a directionally solidified Sn–Cu solder alloy
Wislei R. Osório, José E. Spinelli, Conrado R.M. Afonso, Leandro C. Peixoto, Amauri GarciaVolume:
56
Année:
2011
Langue:
english
Pages:
9
DOI:
10.1016/j.electacta.2011.07.114
Fichier:
PDF, 1.67 MB
english, 2011